Hi,
On Thu, Jan 29, 2015 at 5:27 PM, Dr. H. Nikolaus Schaller hns@goldelico.com wrote:
PS: I am in the middle of placing the copper traces for the CPU board. Looks as if it is just time-consuming, but no big hurdles are visible. It is indeed easier on a 8-layer 100um structure PCB with micro-vias than a 4-layer board without and 150um structure (making it much cheaper…). With a little luck we will have our own omap5 board soon (there can be an engineering variant with 2 SD slots and a micro-USB socket for external power and FTDI console - I plan to build 1, maybe 2 of these for board bringup)
Aren't we going to have some UART-to-USB solution on the charging port on final boards too?
Gražvydas